Lanner Electronics, Radisys, and Hytec Inter announced today a collaboration to create a high-performance, containerized-based 5G private network solution with flexible deployment options for various industries. The cost-effective, fully disaggregated 5G RAN solution, integrated by Hytec Inter, includes Lanner's Open RAN appliances and Radisys' CU and DU software, to deliver secure, real-time communication for enabling low-latency services for mission-critical applications. A demonstration of the solution will be available for viewing at Lanner's booth (Booth no.5A27) at MWC Barcelona, from February 27 through March 2nd.
To enable the Kubernetes-containerized CU/DU software, Lanner provides the interoperable Open RAN appliance ECA-4027 designed to enable Radisys' 5G RAN software that supports the latest 3GPP and O-RAN specifications. Powered by 12~16 cores Intel® Xeon® D-2100 series processor (codenamed Skylake-D), the ECA-4027 is a 37cm short-depth CU/DU edge server, offering 8x 10G SFP+ ports, -40 to 65°C wide operating temperature range, Intel® QAT crypto acceleration, IEEE 1588v2 Time Sync support and PCI-E expansion capability for FPGA or GPU acceleration.